Place devices at 8000 per hour.


Die Sorting from wafers to trays or to new wafers with known good die
 
Create 200mm wafers from 300mm wafers
 
Vision inspection before picking, after placement

Quick Setups/Changeovers

Wafer Mapping/Ink Dot Recognition

Wafer Stretching

Windows® XP Operating system

Meets CE Mark and SEMI S2 Specs