LED sorter with integrated
vision inspection.

LED sorting into 148 bins

Pick and place at over 11000 parts per hour

Dynamic vision mapping of each wafer

Automated cassette handling of wafers and bin frames

Whole and partial wafers up to 6 inch diameter

Vision inspection of each LED before picking and after placement

Devices as small as 150µm square

Die tracking data for each offloaded frame

Network mapping and tracking data with
host system