Die sorting from bumped wafers to tape reel at 16,000 devices per hour.
 
Pick, flip and place devices from wafer to tape reel with 4 point vision inspection process

Automatic tool calibration

Single touch screen Graphical User Interface

Real time wafer map display

Throughput
16,000 UPH
Footprint
1651mm x 1379mm
Placement Accuracy
25µm@3s
Wafer Size
200mm standard
150 mm, 300mm optional
Die Size
0.5mm x 0.5mm to 12.5mm x 12.5mm
Tape Width
8mm to 24mm

Advanced Packaging Award Winner!

Laurier Incorporated
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